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hcnw115ajte - tr clcc type outer dimension: 3.0 x 2.5 x 0.77mm ( l x w x h ) ? adjusted to automotive lighting standards ? high reliability, high flux, low thermal resistance package ? suitable light source for outer lens which is designed by customer emitting area : 1mm square ? lead - free soldering compatible ? rohs compliant package product features recommended applications features ? exterior light source for automotive, motorcycle (head lamp, drl, cornering lamp, fog lamp, etc.) ? led flood light ? light source for other equipment standard product reference sheet page : 1 2016.11.25
hcnw115ajte - tr outline dimensions unit mm weight 20.0mg tolerance 0.2 page : 2 emission size 0.98 laser marking area cathode mark , , height of emission anode cathode inside circuit cathode anode top view side view bottom view cross section 2016.11.25 no. part name material qty. led die ingan 1 protection diode si 1 encapsulant silicone resin + phosphor 1 glass plate silicone dioxide 1 encapsulant silicone resin 1 lamp housing glass ceramic 1 electrode au plating anode:1 cathode:2
hcnw115ajte - tr recommended soldering pattern unit mm page : 3 recommended solder temp. measurement point cu pattern solder resist solder stencil apertural area recommended solder stencil thickness 150m 2016.11.25
hcnw115ajte - tr specifications page : 4 2016.11.25 i f derate linearly from "tj=125 260 typ. max. 3.0 3.9 forward current ma t sld i f 8.0 ma/ thermal characteristics notes1 notes1 notes2 notes4 ? 1 storage temperature t stg electro static discharge threshold "hbm"(ta=25 ) esd 8,000 v -40 +125 -40 +125 p d white ingan white product overview lamp housing color die material emitting color emission area color yellow item symbol maximum ratings units mw 100 1,200 ma 5,016 (ta=25 ) absolute maximum ratings power dissipation symbol item t opr repetitive peak forward current "1ms, 1/20duty" i frm 2,000 i f units the range of operating and storage temperature are not taping condition. esd testing method eiaj4701/300(304) human bodu model (hbm) 1.5k?,100pf notes1 notes2 thermal resistance junction - solder point r th(j-s) /w notes3 please refer to page 25, "reliability test results". junction temperature tj 150 operating temperature soldering temperature "reflow soldering" notes4 please refer to page 11, "soldering conditions". notes3
hcnw115ajte - tr specifications page : 5 x direction y direction 2016.11.25 - notes6 notes5 notes5,7 chromaticity coordinates cx i f = 1,000ma - 0.326 - cy - average color rendering index ra i f = 1,000ma - 67 - - deg. ?y - 117(y-dir) - half intensity angle ?x i f = 1,000ma - 117(x-dir) 0.335 electro-optical characteristics forward voltage min. typ. max. 3.25 v units v f 3.75 (ta=25 ) i f = 1,000ma notes5 notes8 v v i f = 1,000ma 2.75 v r luminouse flux 265 310 410 lm reverse voltage conditions item symbol not designed for reverse operation note5 r efer to the attached sheets for each sorting chart. note6 d o not input reverse voltage and reverse current for prevent the destruction. note7 chromaticity are according to cie1931. note8 full width of viewing angle at half maximum of i v . x direction and y direction are as shown in the figure below.
hcnw115ajte - tr specifications page : 6 2016.11.25 leds shall be sorted out into the following chart and each rank shall be packed separately for shipping. rank luminous flux v (lm) conditions c 280 300 min. max. b 265 280 i f =1,000ma ta=25 d 300 330 e 330 370 f 370 410 notes tolerance on luminous flux : 7% measurement timing : instantly after lighting sorting chart for luminous flux : v rank forward voltage v f (v) conditions min. max. a tolerance on forward voltage : 0.1v measurement timing : instantly after lighting c 3.25 3.50 d 3.50 3.75 2.75 3.00 i f =1,000ma ta=25 b 3.00 3.25 sorting chart for forward voltage : v f leds shall be sorted out into the following chart and each rank shall be packed separately for shipping. notes
hcnw115ajte - tr 0.275 0.325 0.375 0.275 0.325 0.375 specifications page : 7 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 notes chromaticity coordinates tolerance 0.01 measurement timing instantly after lighting sorting c hart for chromaticity : cx , cy led's shall be sorted out into the following chart and each rank shall be packed separately for shipping. cie c hromaticity diagram cie chromaticity diagram (enlarged view) a b c ece no.48 white area planckian (bbl) 2016.11.25 rank x y rank x y rank x y 0.3213 0.3421 0.3300 0.3554 0.3380 0.3615 0.3232 0.3138 0.3302 0.3269 0.3374 0.3422 0.3178 0.3037 0.3232 0.3138 0.3302 0.3269 0.3145 0.3301 0.3213 0.3421 0.3300 0.3554 a b c (i f =1,000ma ta=25 )
hcnw115ajte - tr 0 50 100 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 x y 0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780 relative intensity vs. wavelength condition : ta = 25 , i f =1,000 ma wavelength ( nm ) spatial distribution condition : ta = 25 , i f =1,000ma relative radiant intensity (%) technical data relative intensity x direction y direction page : 8 100 50 0 50 100 0 30 60 90 - 30 - 60 - 90 2016.11.25
hcnw115ajte - tr -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0 50 100 150 0.4 0.6 0.8 1.0 1.2 1.4 0 50 100 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 100 200 300 400 500 600 700 800 900 1,000 1,100 1,200 100 200 300 400 500 600 700 800 900 1,000 1,100 1,200 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 junction temp. vs. v f condition : i f =1,000ma junction temp . tj ( ) relative luminous flux junction temp. vs. relative luminous flux condition : i f =1,000ma junction temp. tj ( ) relative luminous flux forward voltage vs. forward current condition : ta = 25 forward voltage v f (v) forward current i f ( ma ) v f : (v) technical data forward current vs. relative luminous flux condition : ta = 25 forward current i f ( ma) page : 9 2016.11.25
hcnw115ajte - tr 0.30 0.31 0.32 0.33 0.34 0.35 0.30 0.31 0.32 0.33 0.34 0.35 0 50 100 150 cx cx c 0.31 0.32 0.33 0.34 0.35 0.36 0.31 0.32 0.33 0.34 0.35 0.36 100 300 500 700 900 1,100 cx cx c junction temp. vs. chromaticity condition : i f =1,000ma junction temperature tj ( ) forward current vs. chromaticity condition : ta = 25 forward current i f (ma) technical data page : 10 2016.11.25 0 100 200 300 400 500 600 700 800 900 1,000 1,100 1,200 1,300 -20 0 20 40 60 80 100 120 140 160 max. forward current vs. ambient temp. junction temperature : tj ( ) maximum forward current : i fmax (ma )
hcnw115ajte - tr soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density . please do not repeat the heating process in reflow process more than twice . 4. when using a metal pcb, the solder may crack and problems may occur due to major stress on the soldered portion caused by thermal shock. please carry out a thorough advance verification before use. for the metal pcb's insulation, it is recommended to use stress - reducing materials note 1 temperature profile for the reflow should be set to the surface temperature of resin which is on the top of led. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . note 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution ( acc.to eiaj - 4701/300 ) page : 11 2016.11.25 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 120sec pre - heating (soldering 230 peak temperature
hcnw115ajte - tr soldering condition 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touches the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature, before using. also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality . 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended. 7. flow soldering (dip soldering) is not recommended for this product . 8. isopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. please review the reference chart below for cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. the curing condition, temperature:150 max./time:120sec.max . recommended manual soldering condition temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time chemical adaptability ethyl alcohol isopropyl alcohol pure water trichloroethylene chlorothene acetone thinner hexane page : 12 2016.11.25
hcnw115ajte - tr handling precaution led with an ingan die is sensitive to voltage surges generated by on/off status change and friction with synthetic materials, which may cause severe damage to the die or undermine its reliability. damaged products may experience conditions such as extremely high reverse voltage, decrease of forward rise voltage, deterioration in optical characteristics. stanley ingan products are packed with anti - static components. however, following precautions must be taken into account upon product shipment. do not place electrified non - conductive materials near the led product. avoid led products from coming into contact with metallic materials.( should the metallic material be electrified , the sudden surge voltage will most likely damage the product .) avoid a working process which may cause the led product to rub against other materials . install ground wires for any equipment, where they can be installed, with measures to avoid static electricity surges . prepare a esd protective area by placing a conductive mattress (1m max.) and ionizer to remove any static electricity. operators should wear a protective wrist - strap. operators should wear conductive work - clothes and shoes. to handle the products directly, stanley recommends the use of ceramic, and not metallic, tweezers. 2. working environment a dry environment is more likely to cause static electricity. although a dry environment is ideal for storage state of led products, stanley recommends an environment with approximately 50% humidity after the soldering process. recommended static electricity level in the working environment is 150v, which is the same value as integrated circuits (which are sensitive to static electricity). for electric static discharge ( esd ) 1. electrification/static electricity protection in order to avoid product (die) damage from static electricity caused by unprotected handling by operator and other charged materials coming in contact with the product, stanley recommends taking the following precautions. page : 13 2016.11.25
hcnw115ajte - tr handling precaution other precautions 1. the products are designed to achieve higher performance reliability , however , they can be influenced by usage conditions. 2. absolute maximum r atings are set to prevent led products from breaking due to extreme stress (temperature , current, voltage, etc.). these ratings must never be overrun even for a moment. 3. to achieve the highest performance reliability, it is necessary to take into account, factors such as forward voltage adjusted to the usage temperature condition, d erating of the power consumption, and other variable factors. 4. please insert straight protective resistors into the circuit in order to stabilize led operation and to prevent the device from overheating . 5. also please make sure there isn't any gas in the surrounding area or entering from outside when using the products. 6 . please avoid to stick foreign materials because molding resin in the products has adhesiveness. and please do not touch emission area.. 7. supersonic wave welding is not recommended because wire open circuit may occur. ex ) bonding outer lens to this product or housing 8 . please check the actual performance in the assembly because the s pecification sheets are described only for led device. 9 . please refrain from looking directly at the light source of the led at high output, as it may harm your vision . 10. the products are designed to perform without failure in the recommended usage conditions. however , please take the necessary precautions to prevent from a fire , injury, and other unexpected failures . 11. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, medical applications, nuclear reactor control systems and so on ). 12. the formal specification sheets shall be exchanged and signed by both parties. page : 14 2016.11.25
hcnw115ajte - tr 1. picking up point with nozzle: lamp housing of the product (shown below) recommendation 2. recommended nozzle shape handling precaution handling precautions for product mounting lens portion is the state of the hollow pick up point. (lamp housing portion) non allowed pick up area (lens portion) outside diameter : 3.5mm inside diameter : 1.7mm the picking up point should be within lamp housing portion, because the silicone resin used for the lens is soft. (if the nozzle makes contact with the lens, the products might be destroyed) please adjust the load, the pick up point, the nozzle diameter, etc. before mounting because the over load can cause the breakage of the lamp housing. load : less than 3n to avoid the product breaking page : 15 2016.11.25
hcnw115ajte - tr this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. this product is equivalent to ipc/jedec j - std - 020d msl 2. the package should not be opened until immediately prior to its use . if any components should remain after their use, please seal the package and store them under the conditions described in the above recommended storage condition . baking process should be performed after putting out from package. baking conditions: 10h(min.), at +60 5 just before use baking may be performed in the tape - reel form, however if it is performed with the reel stacked over one another, it may case deformation of the reels and taping materials, which may cause problems during production. please make sure that the product has cooled to normal temperature after performing the baking process. provided that, baking process shall be 2 times max. time elapsed after package opening in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 60% page : 16 packaging specifications 2016.11.25
hcnw115ajte - tr moisture - proof packaging specification fastener for re - storage after opening bag. customer's opening position. product label desiccant with indicator for moisture level is enclosed. 1 a packaging specifications heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting no. part name materials remarks moisture - proof bag with aluminum layer pet+al+pe with esd protection page : 17 2016.11.25 yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
hcnw115ajte - tr packing box ( rohs ? elv compliant ) the above measure is all the reference value. the box is selected out of the above table by shipping quantity. packaging specifications box type outline dimension l w h (mm) capacity of the box type a 280 265 45 3 reel type b 310 235 265 15 reel type c 440 310 265 30 reel type a material / box cardboard c5bf type b,c material / box cardboard k5af partition cardboard k5af page : 18 2016.11.25 no. part name matelrial remarks packing box corrugated cardboard without esd protection
hcnw115ajte - tr label specification (acc.to jis - x0503(code - 39 )) product label a. parts number b. bar - code for parts number c . parts code (in - house identification code for each parts number) d. packed parts quantity e. bar - code for packed parts quantity f. lot number & rank (please refer to lot number notational system for details ) g . bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number bar - code font : acc.to code - 39(jix0503) packaging specifications b a page : 19 2016.11.25
hcnw115ajte - tr taping and reel specifications (acc.to jis - c0806 - 03 appearance note " - tr" means cathode side of leds should be placed on the sprocket - hole side. items specifications remarks leader area cover - tape cover - tape shall be longer than 300mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 25 pieces (100mm) . please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 40 pieces (160mm) . the end of taping shall be inserted into a slit of the hub. page : 20 2016.11.25
hcnw115ajte - tr taping and reel specifications (acc.to jis - c0806 - 03 qty. per reel mechanical strength others 3,000parts/reel minimum qty. per reel might be 500 parts when getting less than 3,000 parts. in such case, parts of 100 - unit - qty. shall be packed in a reel and the qty. shall be identified on the label cover - tape adhesive strength shall be 0.1 1.3n ( an angle between carrier - tape and cover - tape shall be170 deg. ). both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mix shall not be held . empty pocket per reel is assumed until 1 piece. page : 21 2016.11.25
hcnw115ajte - tr taping dimensions reel dimensions taping and reel specifications (acc.to jis - c0806 - 03 unit :mm page : 22 2016.11.25
hcnw115ajte - tr lot number notational system page : 23 - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year 20099 , 2010 0 , 2011 1 , ? ?? ) - 2digits production month (jan. to sep. should be 01 , 02, 03, ? ???? ) - 2digits production date - 3digits serial number - 2digits tape and reel following number - 2digits luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 2digits chromaticity rank (if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) if there is no identified vf rank, - " is used to indicate . - 1digit vf rank 2016.11.25
hcnw115ajte - tr correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 24 2016.11.25
hcnw115ajte - tr reliability testing result 1. reliability testing result 2. failure criteria page : 25 ta 30min / cycle fig.1 thermal shock cycle condition 15min 15min 125 - 40 2016.11.25 6 thermal shock cycle ta=-40 (15min.) 125 (15min.) as shown in the fig.1 below 1,000cyc 0/18 7 resistance to reflow soldering m oisture soak:jedec level2 preheating:150 180 120sec m ax. soldering:260 5sec 2times 0/18 4 high temperature storage life ta=125 3,000hr 0/18 5 low temperature storage life ta=-40 1,000hr 0/18 3 high temperature humidity bias ta=85 rh=85% tj=150 i f =1000ma 1,000hr 0/18 2 low temperature operating life ta=-40 i f =1,000ma 1,000hr 0/18 no. test item test condition duration failure 1 high temperature operating life tj=150 i f =1,000ma 5,500hr 0/18 chromaticity forward voltage item luminous intensity symbol conditions acceptance criteria i v i f =1,000ma ta=25 initial value 0.8 t esting min. value & initial value 1.2 Q t esting max. value cx, cy i f =1,000ma ta=25 initial value - 0.02 measured value initial value + 0.02 v f i f =1,000ma ta=25 initial value 0.9 measured value initial value 1.1 appearance notable discoloration, deformation and crack
hcnw115ajte - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 26 2016.11.25

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